chip bead array design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. & 1 9 2 $ 3 4 5 # 6 # 7 8 9 10 6 11 12 noise filter high speed signal type b chip size 1005 mm x4 array multilayer chip bead the ?rst two digits are signi?cant ?gure of impedance value and the third one denotes the number of zeros following packing embossed carrier taping code u product code type characteristics size nominal impedance form suf?x b ringing suppression type a ferrite core inner conductor electrode e f a b d c features space saving ssop package (0.5 mm pitch) compatibility small size and lightweight rohs compliant type: exc28bb suitable for high speed signals (over 50 mhz) excellent cross talk characteristics (100 mhz:<-25 db) type: exc28ba reduces waveform ringing noise excellent cross talk characteristics (100 mhz:<-30 db) explanation of part numbers recommended applications small digital equipment such as pcs, printers, hdd, dvd-roms, cd-roms, lcds. digital audio and video equipment such as dsc, dvc, cd players, dvd players, md players. electronic musical instruments, and other digital equipment. chip bead array type: exc28b construction dimensions in mm (not to scale) type (inch size) dimensions (mm) mass (weight) [mg/pc.] abcdef exc28b (0804) 1.000.15 2.00.2 0.50.1 0.200.15 0.50.1 0.250.10 5.2 nov. 2012 02 3 9
chip bead array design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 400 350 300 250 200 150 100 50 0 1 10 100 1000 10000 z x r frequency(mhz) | z | ,r,x( ?) 400 350 300 250 200 150 100 50 0 1 10 100 1000 10000 | z | ,r,x( ?) frequency(mhz) z x r 400 350 300 250 200 150 100 50 0 1 10 100 1000 10000 frequency(mhz) z x r | z | ,r,x( ?) 400 350 300 250 200 150 100 50 0 1 10 100 1000 10000 frequency(mhz) z x r | z | ,r,x( ?) ratings impedance characteristics (reference data) measured by hp4291a exc28ba121u (2010) exc28bb121u (2010) exc28ba221u (2010) exc28bb221u (2010) type part number imped ance rated current (ma dc) dc resistance ( ) max. ( ) at 100mhz tol.(%) ba exc28ba121u 120 25 100 0.5 exc28ba221u 220 0.7 bb exc28bb121u 120 0.5 exc28bb221u 220 0.7 z : impedance r : resistance x : reactance categor y temperature range C40 c to +85 c nov. 2012 02 4 0
chip bead array design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 87 6 5 12 34 8765 1234 t 1 t 2 d 0 p 1 p 2 p 0 a b fe w f chip component sprocket hole compartment tape running direction e t w fd fc fa fb taping reel embossed carrier taping standard reel dimensions (mm) embossed carrier dimensions (mm) part number kind of taping pitch (p 1 )q u a n t i t y exc28b u embossed carrier taping 4 mm 5000 pcs./reel packaging methods (taping) standard quantity part number a b w f e p 1 p 2 p 0 0 d 0 t 1 t 2 exc28b u 1.200.15 2.250.15 8.00.2 3.50.1 1.750.10 4.00.1 2.00.1 4.00.1 1.50.1 0.250.05 0.900.15 part number 0 a 0 b 0 c 0 de w t exc28b u 180 C3.0 60.01.0 13.00.5 21.00.8 2.00.5 9.00.3 11.41.5 0 circuit confi guration(no polarity) nov. 2012 02 4 1
chip bead array design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. a dcd ef efe e f b preheating peak heating temperature time recommended land pattern design recommended soldering conditions recommendations and precautions are described below. safety precautions the following are precautions for individual products. please also refer to the common precautions for noise suppression device shown on this catalog. 1. use rosin-based ? ux or halogen-free ? ux. 2. for cleaning, use an alcohol-based cleaning agent. be fore using any other type, consult with our sales person in advance. 3. do not apply shock to chip bead array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, their bodies may be chipped, affecting their performance. excessive mechanical stress may damage the bead arrays. handle with care. 4. store the bead arrays in a location with a temperature ranging from C 5 c to +40 c and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages. dimension (mm) a1.4 b1.75 c0.4 d0.5 e0.25 f0.25 preheat with a blast of hot air or similar method. use a soldering iron with a tip temperature of 350 c or less. solder each electrode for 3 seconds or less. never touch this product with the tip of a soldering iron. temperature time preheating 140 c to 160 c 60 s to 120 s main heating above 200 c 30 s to 40 s peak 235 10 c max. 10 s temperature time preheating 150 c to 170 c 60 s to 120 s main heating above 230 c 30 s to 40 s peak max. 260 c max. 10 s recommended soldering conditions for re? ow for soldering (example : sn-37pb) for lead-free soldering (example : sn/3ag/0.5cu) re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. flow soldering we do not recommend ? ow soldering , because ? ow soldering may cause bridge s between the electrodes. nov. 2012 02 4 2
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